Amaoe Reballing Stencil Qualcomm CPU QU1-QU8 0.12 mm

Amaoe Qualcomm CPU Baseband 0.12MM BGA Reballing Stencil Tin Planting Net QU1 QU2 QU3 QU4 QU5 QU6 QU7 QU8 QU9. Stencil Reballing BGA serie Amaoe QU per Reballing IC Snapdragon CPU Qualcomm.

Opzione:
QU:1 stencil: Per CPU Qualcomm MSM8996 B, MSM8976 B, MSM8992 B, MSM8996 A, MSM8976 A, MSM8992 A.
QU:2 stencil: Per CPU Qualcomm MSM8953 B01, MSM8937, MSM8998 B, MSM8953 1AB, MSM8916, MSM8998 A.
QU:3 stencil: Per CPU Qualcomm MSM8953 B01, MSM8937, MSM8998 B, MSM8953 1AB, MSM8916, MSM8998 A.
QU:4 stencil: Per CPU Qualcomm MSM8994 B, MSM8974 B, MSM8960 B, MSM8994 A, MSM8974 A, MSM8960 A.
QU:5 stencil: Per CPU Qualcomm SDM845, SM8150, SDM670, MSM8917, SDM845 RAM, SM8150 RAM, SD710, SM6150.
QU:6 stencil: Per la banda base della CPU Qualcomm QSC6270, MDM9600, MSM6260, MSM7227, QSC1110, MDM6600, MSM6246, MSM8909W, QSC1105, MDM8215, MDM9215M, MSM7521.
QU:7 stencil: Per CPU Qualcomm Snapdragon 460-SM4250, 665-SM6125, 662-SM6115, 720G-SM7125, 730G-SM7150, 750G-SM7225, 765G-SM7250, 775G-SM7350.
QU:8 stencil: Per Qualcomm CPU SM8250-102 piccola, SM8250-102 grande, SDM439, SM8250-102 RAM piccola, SM8250-102 RAM grande / SM8350 RAM, SM8350 Snapdragon 888.
QU:9 stencil: per Snapdragon SM8750, SM8635, SM8550, SM8450, SM8650, SM7475, SM8475, SM8425, SM7550, BGA496.